Senior TSV & High-Speed Memory Interface Engineer (Equity)
micron technologySan Jose (CA)
Senior TSV & High-Speed Memory Interface Engineer (Equity)
Posted yesterday
micron technologySan Jose (CA)
SENIORITY
Lead
About the role
Micron Technology, Inc. in the United States is seeking an experienced engineer to design and optimize TSV interface circuits that connect memory die to logic die, including Rx/Tx channels and timing margin analysis. You will develop TSV models, define constraints for datapath interfaces, and ensure signal and power integrity across a highly parallel bus, with collaboration across process technology and DTCO teams.
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