Staff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind

Posted 9 days ago

micron usaBoise (ID)

Microsystems Engineers Semiconductor and Related Device Manufacturing

SENIORITY

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About the role

Micron Technology seeks an experienced R&D engineer to advance wafer edge trim, backgrind and thinning processes for next-gen memory products. You will collaborate with process integration and adjacent areas to meet performance and yield targets, while solving complex mechanical and material challenges. The role emphasizes experimental design (DOE), data analysis, and scalable solutions with strong ownership and independent work ability.

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