Senior Director, Chiplet Packaging & FCBGA Innovation

Posted today

amkor technologyTempe (AZ)

Computer Hardware Engineers Semiconductor and Related Device Manufacturing

SENIORITY

Manager

Apply

About the role

Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets. The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.

Before you apply

Applying takes about a minute. These four things decide how fast it moves after that.

Your profile is current

It's what we read first. Occupations, seniority and locations matter more than a long history.

Two examples you can talk through

Not a portfolio — just two pieces of work where you can explain the decisions and what you'd change.

A number in mind

What you're on now and what would make you move. We negotiate better when we know both.

Your notice period

Employers plan around it, and it's the question that stalls offers most often.

Once you apply, someone reads it and calls you before anything reaches the employer — usually within two working days.