Senior Wafer Bonding Process Engineer
1000 micron technologyBoise (ID)
Senior Wafer Bonding Process Engineer
Posted yesterday
1000 micron technologyBoise (ID)
SENIORITY
Lead
About the role
Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches.
You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.
Before you apply
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Your profile is current
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Two examples you can talk through
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A number in mind
What you're on now and what would make you move. We negotiate better when we know both.
Your notice period
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Once you apply, someone reads it and calls you before anything reaches the employer — usually within two working days.
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