Senior Director, Chiplet Packaging & HDFO Strategy

Posted today

microprecision technologiesTempe (AZ)

Computer Hardware Engineers Semiconductor and Related Device Manufacturing

SENIORITY

Manager

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About the role

Amkor Technology in Tempe, AZ, seeks a Sr. Director, Chiplets/FCBGA to lead the strategy, development and execution of advanced chiplet-based packaging solutions for AI, HPC, networking, and PC markets. You will drive roadmaps and commercialization with Tier 1 customers and Amkor's R&D center in Korea. The role requires 12+ years in semiconductor packaging, a Bachelor's in Engineering (Master's preferred), and strong leadership in global programs, with 20% domestic and 20% international travel.

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