Senior 2.5D/3D Packaging Architect for HPC & Auto
Posted 10 days ago
mediatek research labSan Jose (CA)
Computer Systems Engineers/ArchitectsComputer Systems Design Services
SENIORITY
Senior
SALARY
$171,000 to $272,000
About the role
MediaTek Research Lab Inc. in San Jose is looking for an experienced Packaging Architect specializing in advanced semiconductor packaging technologies like 2.5D/3D/3.5D. This position involves collaboration with various teams to develop innovative packaging solutions for automotive and computing applications.
The ideal candidate should possess over eight years of hands-on experience and excellent communication skills. Competitive salary range is $171,000 to $272,000, plus benefits including health insurance and a 401(k).
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