High-Speed Packaging Design Engineer
advanced micro devicesSan Jose (CA)
High-Speed Packaging Design Engineer
Posted today
advanced micro devicesSan Jose (CA)
SENIORITY
Senior
About the role
AMD's Adaptive and Embedded Computing Group seeks an experienced electrical package design engineer to join the AECG - Embedded Team. You will work across chip, technology and systems teams to define cost‑effective, high‑performance packaging for FPGA devices.
Responsibilities include using Cadence tools for design and sign‑off, conducting routing, stack‑up, and PDN studies, and collaborating with PCB layout engineers to optimize die size and ballmap.
Before you apply
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A number in mind
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Your notice period
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