Optical 3D Packaging Technologist
$188,000- $356,000
Apply (opens in a new tab)Optical 3D Packaging Technologist
Posted 42 days ago
SENIORITY
Senior
SALARY
$188,000- $356,000
About the role
- Develop and validate optical interconnect including Co-Package-Optics (CPO), Fiber Attachment Unit (FAU), Optical Engine (OE), etc. package/assembly solutions for 2.5D/3D/3.5D package architectures.
- Collaborate with package/chip design, thermal modeling, substrate engineering, PI/SI, and test engineering teams to deliver optical interconnect technology.
- Conduct DFM (Design‐for‐Manufacturability) analysis, generate design rule sets for 3DIC/CPO packages and documentations.
- Collaborate with internal cross-functional partners, including, Technology, Design, Test, Quality, GSM and Manufacturing Operation to meet product requirements (RFI, RFQ) and execute MP plans.
- Manage technology development, yield improvement, and production issue troubleshooting together with technology suppliers: Foundries, OSATs and substrate vendors.
- Develop/establish fundamental optical characterization methodology for key components and package/assembly process
- In charge of Package Qualification, New Product Introduction (NPI) and HVM. Main Requirements and
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