Advanced Packaging Engineer 2.5D/3D Interposers
sk hynix americaSan Jose (CA)
Advanced Packaging Engineer 2.5D/3D Interposers
Posted 2 days ago
sk hynix americaSan Jose (CA)
SENIORITY
Senior
About the role
A leading semiconductor firm in San Jose, CA is seeking an Advanced Package Design Engineer. This role involves designing and optimizing high-performance, high-density interposers for chiplet-based architectures. The ideal candidate should have at least 3 years of experience in semiconductor package design, particularly with relevant layout tools. Strong collaboration with PCB and manufacturing teams is essential. The company offers competitive compensation and a comprehensive benefits package including top-tier health insurance and educational reimbursement.
Before you apply
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Your profile is current
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A number in mind
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Your notice period
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