Advanced Packaging Process Engineer: High-Impact

Posted yesterday

intelChandler (AZ)

Packaging and Filling Machine Operators and Tenders Semiconductor Machinery Manufacturing

SENIORITY

Senior

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About the role

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production. You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.

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