Head of Power Packaging & SiC/GaN Technology

Posted yesterday

renesas electronicsAustin (TX)

Electronics Engineers, Except Computer Semiconductor and Related Device Manufacturing

SENIORITY

Manager

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About the role

Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification. The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.

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