Lead IC Package Layout Engineer 2.5D/3D-IC
amazonAustin (TX)
Lead IC Package Layout Engineer 2.5D/3D-IC
Posted 11 days ago
amazonAustin (TX)
SENIORITY
Lead
About the role
Annapurna Labs (U.S.) Inc. seeks a Sr. Package Layout Engineer to lead end-to-end physical design of advanced IC packages for next-generation ML and data center ASICs.
You will own the package layout from floor planning through tape out and manufacturing release, coordinating with silicon, SI/PI, thermal, and manufacturing teams to meet performance and reliability targets. Responsibilities include overseeing 2.5D/3D-IC packaging, flow planning, DFM, and cross‑level optimization across die,
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