Hardware Intern: Soldering & Packaging Research
ibmYorktown Heights (NY)
Hardware Intern: Soldering & Packaging Research
Posted yesterday
ibmYorktown Heights (NY)
SENIORITY
Intern
About the role
IBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.
Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.
Before you apply
Applying takes about a minute. These four things decide how fast it moves after that.
Your profile is current
It's what we read first. Occupations, seniority and locations matter more than a long history.
Two examples you can talk through
Not a portfolio — just two pieces of work where you can explain the decisions and what you'd change.
A number in mind
What you're on now and what would make you move. We negotiate better when we know both.
Your notice period
Employers plan around it, and it's the question that stalls offers most often.
Once you apply, someone reads it and calls you before anything reaches the employer — usually within two working days.
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