CMP Process Engineer II

Job Summary: A Level II CMP Process Engineer is responsible for process consultation, engineering and technical services, as well as customer support for the processes and technologies developed within the CMP (chemical-mechanical planarization) foundry division. Candidate will be primarily engaged to support the processes developed on the AMAT Mirra, IPEC 472 and OnTrak Cleaner platforms within the scope of technical development and limited volume production. Candidate must be able to provide clear and concise process and technical control for internal and external process specifications. The Level II Engineer will mentor less experienced engineers and technicians, provide expertise across multiple projects, and collaborate more extensively with customers to meet their evolving needs.

Essential Duties and Responsibilities: Internal and external technical consultation to drive process implementations for novel device and wafer substrate technologies. Prepare processing tools and all relevant resources (wafers, consumables, chemicals, and supporting metrology equipment) for foundry production or development. Integrate and support customer processes on the IPEC and Mirra CMP polishing platforms as outlined in process success criteria. Support, organize, report, and analyze relevant data generated for and by the customer. Provide expert troubleshooting and resolve more complex process and technical issues independently. Serve as a primary point of contact for customer support and deliver process capability demonstrations, guiding clients through complex processes. Contribute to the continuous improvement of process technologies and lead initiatives to develop best practices. Collaborate with product development and engineering teams to ensure seamless integration of new processes and technologies. Document technical findings, prepare reports, and present detailed process improvements to management and customers. Mentor junior engineers, ensuring technical and professional development. Domestic and occasional international travel up to 15% of the time. Follow ISO procedures and safety policies, including wearing appropriate PPE where required.

Required Education & Experience: Minimum bachelor’s degree in a technical or related semiconductor field or equivalent experience.5 years’ experience in the CMP industry or related field. MS Office and ERP system software literate. Skills &

Competencies: Ability to work independently and on a team to meet time sensitive deadlines Experience with semiconductor fabrication processes and equipment. Strong written and verbal communication skills to work collaboratively in a team-oriented environment with internal and external stakeholders. Proficiency in statistical analysis, process optimization calculations, and data interpretation to validate process improvements. Soft Skills Self-motivated, teamplayer, critical thinking, communication skills, adaptability, goal oriented

Physical Requirements: Employee must be able to lift 40 lbs. Employee must be able to work within a cleanroom environment. Employee must be able to travel if requested. Other duties may be assigned to support the overall business. client has the right to revise and update this job description at any time.