Advanced Microelectronics Packaging Engineer

Posted yesterday

saicGranite Heights (WI)

SENIORITY

Senior

Apply

About the role

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems. The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.

Before you apply

Applying takes about a minute. These four things decide how fast it moves after that.

Your profile is current

It's what we read first. Occupations, seniority and locations matter more than a long history.

Two examples you can talk through

Not a portfolio — just two pieces of work where you can explain the decisions and what you'd change.

A number in mind

What you're on now and what would make you move. We negotiate better when we know both.

Your notice period

Employers plan around it, and it's the question that stalls offers most often.

Once you apply, someone reads it and calls you before anything reaches the employer — usually within two working days.

More like this