Director of Quantum Packaging Engineering
stenegBoulder (CO)
About the role
Steneg is pursuing a Head of Packaging Engineering to lead architecture and development of advanced semiconductor packaging for next-generation ion trap devices. The role partners with physicists, engineers and external suppliers to define long-term roadmaps balancing leadership and hands-on contribution.
The candidate will guide mechanical, thermal, electrical and photonic packaging interfaces, ensuring manufacturability, reliability and system-level performance in a highly collaborative,
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