Principal Thermal Architect — AI Compute & Packaging

Posted today

qualcommSan Diego (CA)

Mechanical Engineers Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing

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About the role

Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms. You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving

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