Overview:
As a Dry Etch Principal Process Development Engineer, you will advance plasma dry etch processes for Micron’s next-generation memory parts and drive them from concept through production integration. You will collaborate with process integration, failure analysis, yield, manufacturing, and equipment engineering to ensure robust etch performance that meets strict electrical and physical specs. You will shape the dry etch technology roadmap and contribute to Micron’s leadership in semiconductor manufacturing. This role offers meaningful impact by solving advanced etch challenges at scale. Compensation / Benefits medical, dental and vision plans paid time-off paid holidays paid family leave
Responsibilities:
Develop and refine dry etch processes for advanced DRAM structures Collaborate with process integration and other process development teams to create innovative solutions Perform root cause and failure mode analysis on process and hardware limitations Design experiments and analyze data to improve capability and yield Support process transfer from development to manufacturing Apply AI-enabled analysis tools, data-driven methodologies, or programming solutions to improve efficiency and decision-making
Key requirements:
7+ years of experience in dry etch process development or related area Strong understanding of plasma etch fundamentals and reactor operation Experience with experimental design, data analysis, and problem solving Ability to work across teams and communicate technical results clearly cross-functional collaboration clear communication problem solving dry etch process development plasma etch fundamentals reactor operation