R&D Scientist, Next‑Gen HPC Materials & Interconnects
avientAvon Lake (OH)
R&D Scientist, Next‑Gen HPC Materials & Interconnects
Posted today
avientAvon Lake (OH)
Materials ScientistsResearch and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
SENIORITY
Senior
About the role
Avient Corporation seeks an accomplished R&D Scientist to lead innovation in next-generation thermoplastic materials for HPC, AI infrastructure, and hyperscale data center applications. This technical leader will develop advanced dielectric materials for high-speed connectors and data communications.
The role combines materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization and influence future growth platforms at Avient’s Corporate
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