R&D Scientist, Next‑Gen HPC Materials & Interconnects

Posted today

avientAvon Lake (OH)

SENIORITY

Senior

Apply

About the role

Avient Corporation seeks an accomplished R&D Scientist to lead innovation in next-generation thermoplastic materials for HPC, AI infrastructure, and hyperscale data center applications. This technical leader will develop advanced dielectric materials for high-speed connectors and data communications. The role combines materials science, electrical performance, device physics, and advanced characterization to accelerate commercialization and influence future growth platforms at Avient’s Corporate

Before you apply

Applying takes about a minute. These four things decide how fast it moves after that.

Your profile is current

It's what we read first. Occupations, seniority and locations matter more than a long history.

Two examples you can talk through

Not a portfolio — just two pieces of work where you can explain the decisions and what you'd change.

A number in mind

What you're on now and what would make you move. We negotiate better when we know both.

Your notice period

Employers plan around it, and it's the question that stalls offers most often.

Once you apply, someone reads it and calls you before anything reaches the employer — usually within two working days.

More like this